改进的小间距塑封的封装结构及封装方法

Packaging structure and packaging method for improved small-space plastic package

Abstract

The invention relates to a packaging structure and a packaging method, in particular to a packaging structure and a packaging method for improved small-space plastic package, and belongs to the technical field of semiconductor package. According to the technical scheme, the packaging structure for the improved small-space plastic package comprises a base plate and a stacked package body located on the base plate and plastically-packaged with a plastic package body; the stacked package body comprises a plurality of bearing substrates and packaging structures located on the bearing substrates; substrate through holes are formed in the bearing substrates; gaps among the adjacent bearing substrates and gaps between the bearing substrates and the base plate are communicated through the substrate through holes; and the plastic package body fills the gaps among the adjacent bearing substrates and the gaps between the bearing substrates and the base plate through the substrate through holes. According to the packaging structure and the packaging method, the structure is simple, the process is simple, the operation is convenient, the packaging cost is reduced, the application range is wide, and the structure is safe and reliable.
本发明涉及一种封装结构及封装方法,尤其是一种改进的小间距塑封的封装结构及封装方法,属于半导体封装的技术领域。按照本发明提供的技术方案,所述改进的小间距塑封的封装结构,包括底板以及位于所述底板上用塑封体塑封的堆叠封装体;所述堆叠封装体包括若干承载基板以及位于所述承载基板上的封装结构,所述承载基板上设有基板通孔,相邻承载基板间的间隙以及承载基板与底板间的间隙通过承载基板上的基板通孔相连通,塑封体通过基板通孔填充相邻承载基板间的间隙以及承载基板与底板间的间隙。本发明结构简单,工艺简单,操作方便,降低封装成本,适应范围广,安全可靠。

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